TDK Network Card Memory Bus Interface Type User Manual

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NAND-type Flash Memory Controller IC GBDriver XR  
Memory Bus Interface Type  
Conformity to RoHS Directive  
For Small Embedded Systems without an ATA/IDE interface  
NAND-type Flash Memory has occupied significant place in embedded systems. In many cases the system size is small and an ATA  
interface is not used. The TDK GBDriver XR bridges those host interfaces without an ATA bus to NAND-type Flash Memory. The built-in  
engine is the TDK GBDriver RA3 controller. The GBDriver RA3 is the recipient of numerous design wins and strong interest from our  
customer base.  
GBDriver XR interfaces with a common memory bus such as SRAM bus, enabling CPU to connect with and thus control NAND-type  
Flash Memory directly. GBDriver XR makes it possible to build storage systems even if they do not have hard disk interface such as ATA/  
IDE. The XR is packaged in an ultra-small, ultra-thin VFBGA. This simplifies insertion into portable devices, mobile terminals, and small  
IT home appliances.  
FEATURES  
SHAPES AND DIMENSIONS  
VFBGA100pin Single Chip  
• World’s first NAND-type Flash Memory controller interfacing with  
common memory bus, such as a one chip LSI solution.  
• Realizes 6MB/s burst writes when directly connected with the  
system bus.  
A1 corner  
marking  
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• Controls NAND-type Flash Memory up to 4GB. Confirmed  
compatibility with Flash Memories of several makers.∗  
• High reliability in Write and Read by TDK original systematic  
control over NAND-type Flash Memory.  
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marking  
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• ATA compatible register interface, suitable for use with the FAT  
file system, only low level driver required.  
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• Available in 8mmVFBGA100pin package.  
• Supports auto recovery function (option)  
8.0  
0.38  
6.75  
100-ø0.25 to 0.35  
0.75  
• Conforms to the RoHS directives.  
Please contact us to confirm the Flash Memory compatibility.  
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Detail of ball  
Substrate  
MAIN APPLICATIONS  
• Flash memory modules  
• Silicon storage  
Solder  
ball  
Land & lead  
Solder resist  
ø0.25  
• Boot devices for embedded systems  
Dimensions in mm  
Opening size  
APPLICATIONN EXAMPLES  
SPECIFICATIONS  
• For NOR Flash-/HDD- replacement applications.  
• For user data storage applications; home information  
appliances, STBs, PDAs, mobile phones, etc.  
• For booting embedded systems of WindowsXP Embedded-base  
or Linux-base.  
120ns[Burst cycle]  
180ns[Single cycle]  
90ns  
2.7 to 3.6V  
2.7 to 3.6V  
Host I/F  
Timing specifications  
Flash I/F  
Host I/F  
Core  
Power specifications  
Flash I/F  
2.7 to 3.6V  
33.33MHz  
System clock  
[External clock support]  
–40 to +85°C  
–55 to +125°C  
41mA[3.0V]  
40mA[3.0V]  
Operating  
Storage  
Reading  
Writing  
Temperature ranges  
Power consumption  
(ref.)  
• GBDriver is a registered trademark of TDK Corporation  
• CompactFlashTM is a trademark of SanDisk Corporation  
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific  
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.  
• All specifications are subject to change without notice.  
001-04 / 20070219 / ew_004.
 

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